Semiconductor & IC manufacturing
Wafer fabs, power and compound semiconductors, packaging and test, and MEMS: cleanrooms, ultra-pure water, specialty gas with gas monitoring, abatement and utilities that never stop.
How FacilityOS helps
- Cleanroom pressure cascades, particle counts by ISO 14644-1 class, temperature, humidity and dew point per zone, with time-in-limit reports.
- Chiller plant and PCW, ultrapure water, bulk and specialty gases, vacuum and abatement in one facility overview.
- Gas monitoring system (GMS) and toxic-gas detectors are monitored only; the platform verifies that the expected shut-off linkage happened and notifies people.
- Power quality on the main buses, since voltage sags are a common hidden cause of tool trips.
Platform modules used
FMCS
Facility management and control
The whole cooling and power chain at a glance, with redundancy, shift handover, utility efficiency and first-out alarm analysis.
Learn more →EPMSElectrical power monitoring system
IEC 61850 read-only, sequence of events to the microsecond, COMTRADE waveforms, power quality, breaker wear, relay settings, arc-flash labels and transformer life.
Learn more →EMSEnergy management system
Electricity, gas, water and steam metering by workshop and system, time-of-use cost, demand, carbon, PUE and tamper-evident report archives.
Learn more →SCADASupervisory control and data acquisition
Editable HMI graphics, live values and trends, bulk history export to CSV and Parquet, event replay, and northbound OPC UA and MQTT Sparkplug B.
Learn more →CMMSMaintenance management
Asset register linked to live data, preventive maintenance by calendar, run hours or starts, signed work orders, QR/NFC inspection rounds, spares and MTBF/MTTR.
Learn more →Segments
Front-end wafer fab (logic / memory)
300 mm fabs with ISO 3–5 zones and hundreds of gases and chemicals.
Learn more →Power & compound semiconductor (SiC / GaN)
Epitaxy and high-temperature processes with heavy H2 and NH3 use; arsine and phosphine for III-V materials.
Learn more →Packaging & test (OSAT / advanced packaging)
ISO 6–7 rooms, reflow, plating and test loads; advanced packaging approaches front-end requirements.
Learn more →MEMS / sensors
Smaller fabs with deep silicon etch and bonding.
Learn more →Systems and equipment
Core: every site of this kind has it. Common: most sites have it. Optional: depends on the site.
Chiller plant & PCW
The plant cools MAUs and dry coils; PCW cools tools, pumps and RF generators.
| Equipment | Level | Points worth watching | Notes |
|---|---|---|---|
| Large centrifugal chiller | Core | CHW supply temp · CHW return temp · Load · Power draw · Efficiency (kW/ton) · Fault | Thousand-ton centrifugals (Trane, York, Carrier, Daikin) on BACnet/IP, typically N+1. |
| Cooling tower cell | Core | Tower leaving water · Tower entering water · Fan speed · Basin level · Water conductivity · Fan vibration | |
| Pump | Core | Running · Speed · Differential pressure | Chilled and condenser water pumps; drives usually on Modbus TCP. |
| Process cooling water loop | Core | Supply temp · Return temp · Supply pressure · Supply-return differential · Loop flow · Loop conductivity · Leak detected | |
| Heat-recovery chiller / heat pump | Optional | Hot water supply temp · Chilled water supply temp (recovery side) · Power draw · Combined COP | Heat recovery displacing boiler gas — one of the main decarbonization levers. |
| Hot-water boiler | Common | Hot water supply temp · Firing rate · Fault | Hot water for MAU preheat and reheat. |
| Plate heat exchanger | Common | Secondary supply temp · Approach · Primary pressure drop | |
| Pressurization / expansion unit | Common | System pressure · Low pressure alarm · Make-up today | |
| Cooling tower chemical treatment | Common | Conductivity · Chemical drum low | |
| Side-stream filter | Optional | Filter differential pressure |
Cleanroom air
Make-up air, recirculation and FFUs hold cleanliness, the pressure cascade and temperature/humidity.
| Equipment | Level | Points worth watching | Notes |
|---|---|---|---|
| Make-up air unit | Core | Supply air temp · Supply dew point · Outdoor airflow · Fan speed · Final filter pressure drop · Fault | Dew-point control sets cleanroom humidity. |
| Recirculation air unit | Core | Supply air temp · Return air temp · Recirculation airflow · Dry-coil valve · Filter pressure drop | |
| Fan-filter unit bank | Core | FFUs running · FFUs in fault · Average speed · Bank power · FFU network fault | Group by feeder or control segment; clustered failures usually mean a circuit. |
| Cleanroom zone | Core | Pressure vs adjacent · Room temp · Relative humidity · Downflow velocity · Target class (ISO 14644-1) · Door held open | Typical cascade 0.02–0.06 inWC (5–15 Pa). |
| Particle counter | Core | Particles ≥ 0.1 µm · Particles ≥ 0.3 µm · Particles ≥ 0.5 µm · Particles ≥ 5.0 µm · Measured class (ISO equivalent) · Above target ISO class | ISO 14644-1 limits are per m³; divide by 35.3147 for per ft³. |
| Cleanroom FMCS summary | Common | Worst zone particles ≥ 0.5 µm · FFUs in fault (all banks) · Zones out of spec | |
| Humidifier | Common | Controlled humidity · Cylinder / nozzle service | |
| Pass-through / airlock interlock | Common | Both doors open · UV lamp hours | |
| Airborne molecular contamination monitor | Common | Acids · Bases (NH₃) | |
| Fab micro-vibration monitor | Optional | VC criterion met · Above tool spec |
Process utilities: CDA, vacuum, bulk & specialty gas
The tools' lifeblood: lose supply and they stop; a leak is a life-safety matter.
| Equipment | Level | Points worth watching | Notes |
|---|---|---|---|
| Clean dry air compressor | Core | Discharge pressure · Output · Load · Power draw · Surge detected · Fault | |
| Desiccant air dryer | Core | Pressure dew point · Pressure drop · Regeneration temp · Fault | Typical pressure dew point −94°F (−70°C). |
| CDA header | Core | Header pressure · Header dew point · Demand | |
| Bulk gas supply | Core | Tank level · Supply pressure · Vaporizer outlet temp · Flow · Impurity · Reserve supply in use | N2, O2, Ar, H2, CO2; tank telemetry is usually the gas supplier's. |
| On-site nitrogen generator | Optional | Product O2 content · Output · Outlet pressure · Off-purity (on LIN backup) | |
| Specialty gas cabinet | Core | Cylinder pressure · Delivery pressure · Cylinder weight (scale) · Cabinet exhaust · Excess-flow trip · Auto-shutoff valve closed · Low cabinet exhaust | Toxic, flammable and corrosive gases live in exhausted cabinets (IFC HPM provisions). |
| Valve manifold box | Core | Distribution pressure · Sticks open · Enclosure exhaust · Enclosure gas detected · Auto-shutoff valve closed | |
| Specialty gas usage meter | Common | Current use · Used today (scf) · Days of supply left | |
| Process vacuum pump | Core | Inlet pressure · Motor power · N2 purge flow · Pump body temp · Service warning | Ebara, Edwards and Kashiyama dry pumps, typically Modbus or Profinet. |
| House vacuum system | Common | Vacuum · Pumps running | |
| Bulk chemical delivery system | Core | Supply tank level · Supply pressure · Supply flow · Drip-pan leak · Double-containment leak · Auto-shutoff valve closed | Acids, bases and solvents in double-contained piping. |
| CMP slurry supplyFront-end wafer fab (logic / memory) · Power & compound semiconductor (SiC / GaN) · Packaging & test (OSAT / advanced packaging) | Core | Day tank level · Loop supply pressure · Loop flow · Large particles ≥ 1 µm (per mL) · Drip-pan leak | |
| Chemical dilution unit | Common | Outlet concentration · Leak · Concentration alarm | |
| Nitrogen purifier | Common | Outlet O₂ | |
| Tank farm level | Common | Level · High-high level · Bund leak | |
| Cryogenic vaporizer | Common | Outlet gas temp · Low outlet temp |
UPW, reclaim & wastewater
UPW quality hits yield directly; wastewater must meet the discharge permit.
| Equipment | Level | Points worth watching | Notes |
|---|---|---|---|
| Reverse osmosis unit | Core | Permeate conductivity · Permeate flow · Recovery · Membrane differential | |
| Electrodeionization unit | Core | Product resistivity · Product flow | |
| UV TOC reducer | Core | UV intensity · Outlet TOC | |
| UPW polishing loop | Core | Supply resistivity · TOC · Dissolved oxygen · Dissolved silica · Particles ≥ 0.05 µm (per mL) · Supply flow · Supply pressure | Typical targets: 18.2 MΩ·cm and TOC < 1 ppb (tighter at leading-edge nodes). |
| Water reclaim system | Common | Reclaim flow · Reclaim rate · Reclaim conductivity · Reclaim TOC · Diverted to drain (off-spec) | |
| pH neutralization system | Core | Effluent pH · Influent pH · Caustic dosing · Acid dosing · Flow | |
| Fluoride wastewater treatmentFront-end wafer fab (logic / memory) · Power & compound semiconductor (SiC / GaN) · MEMS / sensors | Core | Effluent fluoride · Reactor pH · Clarifier turbidity | |
| CMP slurry wastewaterFront-end wafer fab (logic / memory) · Packaging & test (OSAT / advanced packaging) | Common | Effluent turbidity · pH · UF transmembrane pressure | |
| Final effluent monitor | Core | Discharge flow · Discharge pH · COD · Fluoride · Discharge temp | |
| Lift station | Common | Wet-well level · Pumps running · High level | |
| Domestic water booster | Common | Discharge pressure · Flow | |
| Water tank / reservoir level | Common | Level · Low level · Overflow level | |
| Resistivity analyzer | Common | Resistivity |
Exhaust & abatement
Tool exhaust must never fail; abatement keeps the air permit.
| Equipment | Level | Points worth watching | Notes |
|---|---|---|---|
| Process exhaust system | Core | Exhaust main static · Exhaust airflow · Fans running · Low exhaust static | Watch general, heat, solvent and acid exhaust separately; N+1 fans. |
| Acid exhaust scrubber | Core | Recirculation pH · Recirculation flow · Packing pressure drop · Inlet duct static · Low recirculation flow | |
| Alkaline exhaust scrubber | Common | Recirculation pH · Recirculation flow · Packing pressure drop | |
| VOC concentrator | Core | Inlet VOC · Outlet VOC · Removal efficiency · Desorption temp | |
| Regenerative thermal oxidizer | Common | Combustion chamber temp · Inlet solvent (LEL) · Bypass damper open | |
| Point-of-use abatementFront-end wafer fab (logic / memory) · Power & compound semiconductor (SiC / GaN) · MEMS / sensors | Core | Combustion / reaction temp · Inlet pressure · Bypassed (untreated) · Service warning | Point-of-use treatment for PFCs, silane, arsine and the like. |
Power & sub-metering
One voltage sag can drop a whole bay of tools.
| Equipment | Level | Points worth watching | Notes |
|---|---|---|---|
| Medium-voltage switchgear | Core | Bus voltage · Incoming current · Real power · Breaker closed · Protective trip · Relay trouble | Monitor only — never operate breakers. |
| Low-voltage switchgear | Core | Bus voltage · Load current · Real power · Power factor · Current THD · Breaker trip | |
| Power transformer | Core | Top-oil temp · Winding temp · Load · Gas / sudden-pressure alarm · Over-temperature alarm | |
| UPS | Core | Load · Battery runtime · On bypass | SNMP v3 (UPS-MIB). |
| UPS battery string monitor | Core | String voltage · Lowest jar voltage · Highest jar voltage · Highest jar internal resistance · Highest jar temp · State of charge | Per-jar resistance trending (one of the maintenance practices in IEEE 1188). |
| Generator | Common | Running · Output power · Fuel tank level · Starting battery voltage · Not in AUTO | |
| Power quality meter | Common | Voltage THD · Current THD · Voltage sags today · Sag / interruption event | Voltage sags are a common hidden cause of trips. |
| Site utility meter | Core | Site power · Site power (MW) · Energy today · Power factor | |
| Area energy meter | Core | Area power · Energy today · 15-min demand · Power factor | Sub-metering by workshop or system for energy analysis and cost allocation. |
| Natural gas meter | Common | Natural gas flow · Heat input (1,037 BTU/scf) · Gas today (scf) | Natural gas in scfh, converted to BTU/h by heating value. |
| Static transfer switch | Core | On alternate source · Sources out of sync | |
| Battery cell monitoring | Common | Highest cell resistance · Cell alarm | |
| -48 V DC power plant | Common | DC bus voltage · AC input lost | |
| Insulation monitoring device (IT system) | Common | Insulation resistance · Insulation alarm | |
| Busway / cable temperature (DTS) | Optional | Hottest point | |
| Active harmonic filter (APF) | Common | After current THD · Unit load · Modules in fault · Fan fault | |
| Passive (tuned) harmonic filter | Common | After current THD · Capacitor current, measured / rated · Resonance alarm | |
| Automatic capacitor bank | Common | Power factor · Capacitor current, measured / rated · Resonance alarm · Switching operations today | |
| Dynamic voltage restorer (DVR) | Optional | Sags corrected today · On bypass | |
| Power conditioner | Common | Output voltage · Transformer temp | |
| EMI filter | Optional | Leakage current | |
| Transformer DGA monitor | Common | Hydrogen · Acetylene | |
| Bushing monitor | Optional | Power factor (tan δ) · Capacitance change | |
| Winding temperature monitor | Common | Winding hot spot | |
| On-load tap changer control (OLTC) | Optional | Tap position · Tap fault · Operations today | |
| Partial discharge monitor | Common | Discharge magnitude | |
| Switchgear wireless temperature | Common | Hottest point · Phase difference | |
| Arc-flash protection relay | Common | Arc trip · Protection not ready | |
| Neutral grounding resistor monitor | Optional | NGR resistance · Resistor open · Ground fault | |
| Surge arrester monitor | Optional | Total leakage · Resistive current | |
| Flywheel / rotary UPS | Optional | Flywheel speed · Discharging · Bearing temp | |
| Tool PDU / EMO | Common | EMO pressed |
Life safety: gas monitoring, fire, leaks Monitor only
Two-stage alarms set from TLVs; everything monitor-only.
| Equipment | Level | Points worth watching | Notes |
|---|---|---|---|
| Gas monitoring system | Core | Active alarms · Active faults · Auto-shutoff activated · Evacuation alarm | The GMS performs the shut-off interlocks; the platform only monitors. |
| Silane detector | Core | Silane (SiH4) · Alarm 1 (low) · Alarm 2 (high) | TLV 5 ppm. |
| Ammonia detector | Core | Ammonia level · Ammonia alarm | TLV 25 ppm. |
| Chlorine detector | Core | Chlorine (Cl2) · Alarm 1 (low) · Alarm 2 (high) | TLV 0.5 ppm. |
| HF detector | Core | Hydrogen fluoride (HF) · Alarm 1 (low) · Alarm 2 (high) | TLV-C 2 ppm. |
| Arsine detectorFront-end wafer fab (logic / memory) · Power & compound semiconductor (SiC / GaN) | Common | Arsine (AsH3) · Alarm 1 (low) · Alarm 2 (high) | TLV 5 ppb; implant and III-V epitaxy. |
| Phosphine detectorFront-end wafer fab (logic / memory) · Power & compound semiconductor (SiC / GaN) | Common | Phosphine (PH3) · Alarm 1 (low) · Alarm 2 (high) | TLV 50 ppb. |
| NF3 detector | Common | Nitrogen trifluoride (NF3) · Alarm 1 (low) · Alarm 2 (high) | Chamber-clean gas; TLV 10 ppm. |
| Hydrogen detectorFront-end wafer fab (logic / memory) · Power & compound semiconductor (SiC / GaN) | Core | Hydrogen (% LEL) · Alarm 1 (low) · Alarm 2 (high) | |
| Oxygen deficiency monitor | Core | Oxygen · Alarm 1 (O2 below 19.5 %) · Alarm 2 (O2 below 18 %) | Nitrogen and inert-gas areas: 19.5 % and 18 % stages. |
| Fire alarm zone & linkage | Core | Fire alarm · Supervisory · Trouble · Linkage: air handlers stopped · Linkage: fire/smoke dampers closed · Linkage: smoke exhaust running · Linkage: elevators recalled | Linkage proofs verify the fire system did what it should. |
| Fire alarm panel | Core | Fire alarm · Supervisory signal · Trouble signal | Monitor only (NFPA 72). |
| Aspirating smoke detector | Common | Smoke obscuration (%/ft) · Alert · Action · Fire 1 · Airflow fault | |
| Leak detection cable | Core | Leak detected · Distance to leak · Leak zone · Cable break or contamination | |
| Smoke exhaust fan | Common | Running · Damper not proven | Smoke exhaust or stair pressurization fans; monitor only. |
| Fire / smoke damper | Core | Closed · Position fault · Days since test | |
| Clean-agent suppression panel | Core | Discharged · Cylinder pressure low |
Security & video Monitor only
Camera and door status, and video linkage: cameras are linked to areas, devices and alarm rules; on an alarm the gateway takes an ONVIF snapshot and attaches it to the alarm, with a live-view link to the NVR/VMS. Core never contacts a camera.
| Equipment | Level | Points worth watching | Notes |
|---|---|---|---|
| Video camera | Common | Online · Recording · Motion detected · Video analytics alarm · Tamper (blocked or moved) | Status via the VMS (Milestone, Genetec…); on an alarm the gateway takes an ONVIF snapshot and attaches it to the alarm — Core never contacts a camera. |
| Access-controlled door | Common | Door open · Door held open · Door forced | Door events can drive camera linkage. |
| Perimeter intrusion detection | Common | Perimeter alarm | |
| Network switch (SNMP) | Common | Ports down · PSU fault |
Life-safety equipment (fire alarm, gas detection, emergency power transfer) and protection devices are monitored only. FacilityOS never sends them commands.
Standards and compliance
| Standards and compliance | Notes |
|---|---|
| ISO 14644-1 | Cleanroom classification by airborne particle concentration; fabs typically run ISO 3–5 in front-end and ISO 6–7 in packaging. |
| ISO 14644-2 | Monitoring to provide evidence that a cleanroom keeps its class. |
| SEMI S2 | EHS guideline for semiconductor manufacturing equipment. |
| SEMI F63 | Guide for ultrapure water used in semiconductor processing (typical values on the order of 18.2 MΩ·cm and TOC < 1 ppb). |
| NFPA 318 | Standard for the protection of semiconductor fabrication facilities. |
| International Fire Code (HPM) | IFC provisions for hazardous production material (HPM) facilities: gas cabinets, exhaust, gas detection and emergency power. |
| NFPA 55 | Compressed Gases and Cryogenic Fluids Code (bulk tanks, cylinder storage). |
| CGA G-13 | Storage and handling of silane and silane mixtures. |
| ACGIH TLVs | Threshold limit values for airborne chemicals, commonly used to set gas-detector alarm levels. |
| NFPA 72 | National Fire Alarm and Signaling Code. |
| IEC 62443 | Security for industrial automation and control systems. |
| ANSI/ISA-18.2 | Management of alarm systems for the process industries. |
Standards are listed with what they cover; numeric values are typical figures, not requirements for every site. FacilityOS supports your compliance work; it does not certify a site.
KPIs the platform tracks
| KPIs the platform tracks | Notes |
|---|---|
| UPW resistivity | Polish-loop supply resistivity in MΩ·cm; typical target 18.2. |
| Worst-zone particles | Maximum ≥ 0.5 µm count across counters, against each zone's ISO class. |
| CDA dew point | CDA header pressure dew point (°F). |
| Facility MW & energy per wafer | Utility service power; kWh per wafer out from MES wafer starts. |
| Gas alarms | Monthly GMS alarm-1/alarm-2 events and shut-offs. |
Reports
| Reports | Notes |
|---|---|
| Daily cleanroom report | Per-zone particle, pressure and T/RH extremes and excursion time for yield analysis. |
| UPW quality report | Resistivity, TOC, DO, particle and silica trends and excursions. |
| Monthly gas safety report | GMS alarms, shut-offs, detector faults and calibrations due. |
| Discharge & emissions compliance | Outfall pH, fluoride and COD plus scrubber and oxidizer operating records. |
| Energy by area | Energy and demand by CUB, sub-fab and cleanroom. |
How we deliver
We can take a Semiconductor & IC manufacturing project from survey and design through procurement, installation, commissioning and training — all of it, or only the stages you need.
- Site survey & needs assessment
- Solution design
- Procurement
- Installation
- Commissioning & acceptance
- Training
- Go-live & support
Demo site
Hillsboro Wafer Fab
A 24/7 300 mm logic fab: thousand-ton chillers, CDA and bulk gases, ultra-pure water, specialty gas with gas monitoring, ISO 5 cleanrooms and wastewater and exhaust abatement.
Open the Hillsboro Wafer Fab demo site to see this industry with simulated live data: process graphics, video wall, alarm drills and remote adjustment.
Try the live demo